 |
|
|
News: The Advanced Embedded Passive Technology (AEPT), consortium is a National Center for Manufacturing Sciences collaborative R&D effort co funded by industry and the National Institute of Standards and Technology, or NIST. The scope of the AEPT Program focuses on developing the materials, design, and processing technology for embedding passive devices (resistors and capacitors) into circuit board substrates to improve the performance, space requirements, cost, and reliability of circuit boards. Current passive device technology supports a signal of 1 GHz. This program will target frequencies of 1–10 GHz by using embedded passives to maintain signal integrity, enabling significant improvement in data transmission rates. Key innovations include new materials that better fit the application domain along with the process and design accommodations needed to use these materials. The use of sintered polymers, filled and unfilled polymers, solution coated materials, ceramic pastes to perform embedded passive devices, and selective plating will all be explored as part of this program. The consortium team of original equipment manufacturers (OEMs), printed wiring board (PWB) fabricators, material suppliers, and a software tool developer are committed to the program success. Embedded passives are seen
as a key enabling technology in the National Electronics Manufacturing
Initiative (NEMI) Roadmap. The technology developed in this program will
translate to a variety of other applications because of the expanded
performance, potential for lower system cost, reduced area requirements, and
improved reliability |
||
|
|
