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NCMS TO UNVEIL ADVANCED EMBEDDED PASSIVES TECHNOLOGY
Consortium to Deliver AEPT Solution to the
Microelectronics Industry for Developing High-Density and High-Performance
Products
WHAT:
The National Center for Manufacturing Sciences (NCMS) will unveil the ideal
model for combining materials, design and processing technology for
embedding passive devices into circuit board substrates at its AEPT Seminar.
This advanced embedded passives technology will enable microelectronics
manufacturers to economically attain significant performance improvements,
reductions in space requirements and reliability improvement in circuit
boards. The breakthrough findings to be made public for the first time are
the result of a collaborative research project spearheaded by NCMS and
co-funded by industry and the National Institute of Standards and
Technology.
WHAT THE FINDINGS DELIVER:
• New resistor and capacitor materials solutions for the microelectronics
industry’s need for compact, high performance products that incorporate
characterized technology.
• Results of cost-effective solutions for large format circuit boards that
demonstrate high manufacturing yield.
• User-friendly cost modeling, performance simulation and design tools for
product designers.
• Potential to reduce the system cost of resistors to half that of chip
resistors.
• Demonstrated signal integrity improvements at speeds higher than 2.5 GHz.
• Laser trim and test equipment that allows greater accuracy for embedded
resistor technology.
• IPC and UL standards development well underway.
WHEN/WHERE:
January 30, 2003, 8:00 a.m. – 5:00 p.m.
3M Innovation Center
6801 River Place Blvd.
Austin, Texas
REGISTRATION:
Online:
https://www.ncms.org/2201/ssl/epseminarform.htm
Call: Beth Bolog at NCMS, 734/995-7962
Registration Fee: $75.00
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